Invention Grant
- Patent Title: Inverter power module packaging with cold plate
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Application No.: US15437390Application Date: 2017-02-20
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Publication No.: US10321613B2Publication Date: 2019-06-11
- Inventor: Yifan Tang , James Jan , Benson Tsai
- Applicant: Atieva, Inc.
- Applicant Address: US CA Newark
- Assignee: Atieva, Inc.
- Current Assignee: Atieva, Inc.
- Current Assignee Address: US CA Newark
- Agency: Womble Bond Dickinson (US) LLP
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F28F3/12 ; H01L23/473 ; H01H9/52 ; H01L25/11 ; H05K7/14

Abstract:
A heat sink is provided. The heat sink includes a single-piece housing having a floor and two walls, the walls perpendicular to the floor and the walls are parallel to each other. The heat sink includes the housing having an inlet and an outlet. The housing is configured to attach power modules to an outer surface of the floor and to outer surfaces of the two walls. The housing is configured to cool the power modules in response to fluid flow into the inlet.
Public/Granted literature
- US20170229378A1 INVERTER POWER MODULE PACKAGING WITH COLD PLATE Public/Granted day:2017-08-10
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