A wafer shipping device includes a box body having a first slot, a cover body having a second slot, and a sensing circuit module having a first sensor, a second sensor, an indication circuit and a warning device. The first slot and the second slot are used to collaboratively hold a semiconductor wafer. The first sensor and the first sensor are located in the box body for independently sensing whether the semiconductor wafer is inserted in the first slot and the second slot respectively. The indication circuit is electrically connected to the first sensor, the second sensor and the warning device, and correspondingly issued one of types of indication signals to the warning device in response to sensing results obtained from the first sensor and the second sensor respectively.