Invention Grant
- Patent Title: Semiconductor device
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Application No.: US15823606Application Date: 2017-11-28
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Publication No.: US10332806B2Publication Date: 2019-06-25
- Inventor: Wen-Ying Wen
- Applicant: Nuvoton Technology Corporation
- Applicant Address: TW Hsinchu
- Assignee: Nuvoton Technology Corporation
- Current Assignee: Nuvoton Technology Corporation
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Priority: TW105139096A 20161128
- Main IPC: H01L21/74
- IPC: H01L21/74 ; H01L27/02 ; H01L27/06 ; H01L29/06 ; H01L29/10 ; H01L29/66 ; H01L29/73 ; H01L29/735 ; H01L21/8249

Abstract:
Provided is a semiconductor device including a substrate having a P-type conductivity, a buried layer having an N-type conductivity, an NPN bipolar junction transistor (BJT), and a first well region having the P-type conductivity. The buried layer is located on the substrate. The NPN BJT is located on the buried layer. The first well region is located between the buried layer and the NPN BJT. The NPN BJT is separated from the buried layer by the first well region.
Public/Granted literature
- US20180151437A1 SEMICONDUCTOR DEVICE Public/Granted day:2018-05-31
Information query
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