Invention Grant
- Patent Title: Power management application of interconnect substrates
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Application No.: US15374842Application Date: 2016-12-09
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Publication No.: US10332827B2Publication Date: 2019-06-25
- Inventor: Mihalis Michael , Kwang Hong Tan , Ilija Jergovic , Chiteh Chiang , Anthony J. Stratakos
- Applicant: Volterra Semiconductor Corporation
- Applicant Address: US CA Fremont
- Assignee: Volterra Semiconductor Corporation
- Current Assignee: Volterra Semiconductor Corporation
- Current Assignee Address: US CA Fremont
- Agency: Weaver Austin Villeneuve & Sampson LLP
- Main IPC: H05K7/00
- IPC: H05K7/00 ; H01L23/498 ; H01L23/50 ; H01L21/56 ; H01L23/00 ; H01L23/36 ; H01L23/522 ; H01L23/528 ; H01L23/367 ; H01L23/31 ; H01L25/10 ; H01L23/495
Abstract:
Various applications of interconnect substrates in power management systems are described.
Public/Granted literature
- US20170125335A1 POWER MANAGEMENT APPLICATION OF INTERCONNECT SUBSTRATES Public/Granted day:2017-05-04
Information query
