Invention Grant
- Patent Title: Integrated metal gate CMOS devices
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Application No.: US15826806Application Date: 2017-11-30
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Publication No.: US10332883B2Publication Date: 2019-06-25
- Inventor: Ruqiang Bao , Dechao Guo , Vijay Narayanan
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent Vazken Alexanian
- Main IPC: H01L27/092
- IPC: H01L27/092 ; H01L21/8234 ; H01L27/088 ; H01L29/49 ; H01L21/8238 ; H01L21/84 ; H01L27/12 ; H01L29/40 ; H01L29/423 ; H01L29/06

Abstract:
A semiconductor device comprises a first semiconductor fin arranged on a substrate, the first semiconductor fin having a first channel region, and a second semiconductor fin arranged on the substrate, the second semiconductor fin having a second channel region. A first gate stack is arranged on the first channel region. The first gate stack comprises a first metal layer arranged on the first channel region, a work function metal layer arranged on the first metal layer, and a work function metal arranged on the work function metal layer. A second gate stack is arranged on the second channel region, the second gate stack comprising a work function metal arranged on the second channel region.
Public/Granted literature
- US20180090381A1 INTEGRATED METAL GATE CMOS DEVICES Public/Granted day:2018-03-29
Information query
IPC分类: