Invention Grant
- Patent Title: Package and electronic apparatus including a package having a microlens layer and color filter layer
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Application No.: US15910274Application Date: 2018-03-02
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Publication No.: US10332924B2Publication Date: 2019-06-25
- Inventor: Takaaki Hirano , Shinji Miyazawa , Kensaku Maeda , Yusuke Moriya , Shunsuke Furuse , Yutaka Ooka
- Applicant: SONY CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sheridan Ross P.C.
- Priority: JP2013-054587 20130318
- Main IPC: H04N5/374
- IPC: H04N5/374 ; H01L27/146

Abstract:
Provided is a semiconductor device including: a multilayer substrate including an optical element; a light-transmitting plate provided on the substrate to cover the optical element; and a lens of an inorganic material provided between the substrate and the light-transmitting plate. A structure having a same strength as a strength per unit area of the lens is provided at a portion outside an effective photosensitive region where the optical element is formed, when the substrate is viewed in plan.
Public/Granted literature
- US20180190700A1 SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS Public/Granted day:2018-07-05
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