- Patent Title: Back-channel-etched TFT substrate and manufacturing method thereof
-
Application No.: US15749096Application Date: 2017-12-20
-
Publication No.: US10332988B2Publication Date: 2019-06-25
- Inventor: Chunsheng Jiang
- Applicant: Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Applicant Address: CN Shenzhen, Guangdong
- Assignee: SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Current Assignee: SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Shenzhen, Guangdong
- Agent Leong C. Lei
- Priority: CN201711167354 20171121
- International Application: PCT/CN2017/117321 WO 20171220
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L29/45 ; H01L29/49 ; H01L29/66 ; H01L29/417 ; H01L29/423 ; H01L29/786 ; H01L21/3213

Abstract:
The invention provides a BCE TFT substrate and manufacturing method thereof. The method uses low deposition power and low oxygen content to deposit first silicon oxide thin film; then increases deposition power with low oxygen content to deposit second silicon oxide thin film. The first and second silicon oxide thin films form a passivation layer; the second silicon oxide film is implanted with oxygen to form a superficial layer so that the Si:O atomic ratio in the superficial layer is close to or same as Si:O atomic ratio of SiO2, to ensure the passivation layer in contact with the air side is strongly hydrophobic to prevent outside water vapor into the back-channel, while ensuring the side of passivation layer contacting IGZO active layer has a lower oxygen content to reduce the probability of forming unbalanced O-ions at the interface between passivation layer and IGZO active layer.
Public/Granted literature
- US20190157430A1 BACK-CHANNEL-ETCHED TFT SUBSTRATE AND MANUFACTURING METHOD THEREOF Public/Granted day:2019-05-23
Information query
IPC分类: