A package structure for a display includes a flexible base film, a plurality of pads, a light-emitting component array, and a patterned circuit layer. The flexible base film includes a plurality of conductive vias, a first surface, and a second surface opposite to the first surface. The conductive vias connect the first surface and the second surface. A material of the flexible base film includes polyimide and black fillings. The pads are disposed on the first surface. The conductive vias are connected to the pads. The light-emitting component array includes a plurality of light-emitting component sets disposed on the pads and electrically connected to the pads. Each light-emitting component set includes a plurality of light-emitting components having different colors. The patterned circuit layer is disposed on the second surface and electrically connected to the conductive vias.