An OLED packaging method and an OLED package structure are disclosed. The OLED packaging method combines a dam packaging technology and a thin film encapsulation technology. A dam is used to coffer an organic layer and limit a size thereof to ensure that each organic layer is completely covered an inorganic layer disposed thereon to improve a packaging effect. One mask can be used to produce multiple inorganic layers so an amount of masks is decreased to save costs. The OLED packaging structure combines a dam packaging structure and a thin film encapsulation structure. A dam is used to coffer an organic layer and limit a size thereof to ensure that each organic layer is completely covered an inorganic layer disposed thereon to improve a packaging effect. One mask can be used to produce multiple inorganic layers so an amount of masks is decreased to save costs.