Invention Grant
- Patent Title: Surface mount contact, electronic device assembly, and test probe pin tool
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Application No.: US15749810Application Date: 2015-08-06
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Publication No.: US10333238B2Publication Date: 2019-06-25
- Inventor: Peihua Li
- Applicant: Telefonaktiebolaget LM Ericsson (publ)
- Applicant Address: SE Stockholm
- Assignee: Telefonaktiebolaget LM Ericsson (publ)
- Current Assignee: Telefonaktiebolaget LM Ericsson (publ)
- Current Assignee Address: SE Stockholm
- Agency: Sage Patent Group
- International Application: PCT/CN2015/086239 WO 20150806
- International Announcement: WO2017/020295 WO 20170209
- Main IPC: H01R4/02
- IPC: H01R4/02 ; H05K3/34 ; H01R12/52 ; H01R12/57

Abstract:
A surface mount contact (100) for coupling to an electronic device (200, 300), comprising: a conductive pin (10) having an elongated pin body (12), the pin body (12) comprising a first end (122) and a second end (124) opposing to the first end (122); and a heat re-flowable bonding member (20) coupled to the first end (122); wherein the pin body (12) is integrally provided with a support portion (14) in a region of the pin body (12) adjacent to the heat re-flowable bonding member (20). The cost and time of manufacture is reduced.
Public/Granted literature
- US20180219311A1 Surface Mount Contact, Electronic Device Assembly, and Test Probe Pin Tool Public/Granted day:2018-08-02
Information query