Invention Grant
- Patent Title: Shield structure
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Application No.: US15118360Application Date: 2016-07-13
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Publication No.: US10334766B2Publication Date: 2019-06-25
- Inventor: Haijun Zhang
- Applicant: Shenzhen Sunway Communication Co., Ltd.
- Applicant Address: CN Guangdong
- Assignee: SHENZHEN SUNWAY COMMUNICATION CO., LTD.
- Current Assignee: SHENZHEN SUNWAY COMMUNICATION CO., LTD.
- Current Assignee Address: CN Guangdong
- Agency: Stein IP, LLC
- Priority: CN201620189918U 20160311
- International Application: PCT/CN2016/089931 WO 20160713
- International Announcement: WO2017/152562 WO 20170914
- Main IPC: H05K9/00
- IPC: H05K9/00 ; F28F9/007

Abstract:
A shield structure includes a shield bracket, a shield cover, and a shield layer. The shield cover is formed with openings. The shield layer is spliced with the shield cover through a conductive tape layer and covers all openings. The shield cover is formed with openings and a light shield layer is spliced with the shield cover and covers the openings, greatly reducing the weight of the shield cover while ensuring the shielding effect, without compressing space for other elements. The shield layer is thin, capable of lowering down the shield, dissipating heat effectively, reducing the temperature of the whole machine and providing a good environment for the operation of the whole machine, without affecting the shielding effect; and the conductive tape layer is spliced with the shield layer, thus allowing multiple assembling without damaging the whole structure, and facilitating subsequent repair.
Public/Granted literature
- US20180199473A1 SHIELD STRUCTURE Public/Granted day:2018-07-12
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