Invention Grant
- Patent Title: Workpiece processing apparatus
-
Application No.: US15572747Application Date: 2016-03-25
-
Publication No.: US10335918B2Publication Date: 2019-07-02
- Inventor: Taichi Yasuda , Masanao Sasaki
- Applicant: SHIN-ETSU HANDOTAI CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SHIN-ETSU HANDOTAI CO., LTD.
- Current Assignee: SHIN-ETSU HANDOTAI CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2015-119338 20150612
- International Application: PCT/JP2016/001740 WO 20160325
- International Announcement: WO2016/199333 WO 20161215
- Main IPC: B24B37/08
- IPC: B24B37/08 ; B24B49/00 ; B24B37/28 ; B24B53/017 ; H01L21/304

Abstract:
A workpiece processing apparatus including: a center drum that is rotatable around a rotation axis and has at least one first groove formed in the axial direction on the peripheral surface, a carrier having a holding hole to insert and hold a workpiece to be processed, an upper and lower turn table that are rotatable around the rotation axis in a state wherein the carrier holding workpiece is interposed, at least one hook fitted in the upper turn table's internal circumference, with the tip being inserted into the first groove and movable along first groove; wherein the center drum has at least one second groove formed in the axial direction on peripheral surface, and second groove has a length different from that of the first groove and has a supporting surface to support the hook from below at a position above a position where upper turn table processes the workpiece.
Public/Granted literature
- US20180117729A1 WORKPIECE PROCESSING APPARATUS Public/Granted day:2018-05-03
Information query