Invention Grant
- Patent Title: Imidazole compound, metal surface treatment liquid, metal surface treatment method, and laminate production method
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Application No.: US15506681Application Date: 2015-08-27
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Publication No.: US10336708B2Publication Date: 2019-07-02
- Inventor: Tatsuro Ishikawa , Kunihiro Noda , Yasuhide Ohuchi , Hiroki Chisaka , Dai Shiota , Yukitsugu Maeda , Takafumi Imoto , Kouhei Fujita , Yasuyuki Akai
- Applicant: TOKYO OHKA KOGYO CO., LTD.
- Applicant Address: JP Kawasaki-Shi
- Assignee: TOKYO OHKA KOGYO CO., LTD.
- Current Assignee: TOKYO OHKA KOGYO CO., LTD.
- Current Assignee Address: JP Kawasaki-Shi
- Agency: Knobbe, Martens, Olson & Bear LLP
- Priority: JP2015-029325 20150218
- International Application: PCT/JP2015/074280 WO 20150827
- International Announcement: WO2016/031928 WO 20160303
- Main IPC: C07D233/60
- IPC: C07D233/60 ; C23C22/02 ; C23C22/05 ; C23F11/00 ; G03F7/004 ; G03F7/039 ; H05K3/28 ; C08K5/3445 ; G03F7/031 ; G03F7/038 ; G03F7/16 ; G03F7/20 ; G03F7/32 ; G03F7/40 ; H05K1/09 ; H05K3/46

Abstract:
A novel imidazole compound that yields a surface treatment liquid that is very effective at suppressing migration and oxidation of a wiring surface; a metal surface treatment liquid that contains the imidazole compound; a metal surface treatment method that uses the metal surface treatment liquid; and a laminate production method that uses the surface treatment liquid. A metal is surface-treated using the surface treatment liquid which includes a saturated fatty acid or a saturated fatty acid ester of a specific structure, in which a prescribed position is substituted by an aromatic group of a prescribed structure and an imidazolyl group that may have a substituent group.
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