Invention Grant
- Patent Title: Folding and unfolding mechanism
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Application No.: US15775925Application Date: 2017-01-26
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Publication No.: US10337555B2Publication Date: 2019-07-02
- Inventor: Dong Zhou
- Applicant: SHANGHAI HINGWAH HONEYCOMB TECHNOLOGY DEVELOPMENT CO., LTD.
- Applicant Address: CN Shanghai
- Assignee: SHANGHAI HINGWAH HONEYCOMB TECHNOLOGY DEVELOPMENT CO., LTD.
- Current Assignee: SHANGHAI HINGWAH HONEYCOMB TECHNOLOGY DEVELOPMENT CO., LTD.
- Current Assignee Address: CN Shanghai
- Agency: Lackenbach Siegel, LLP
- Agent Andrew F. Young, Esq.
- Priority: CN201610061394 20160128; CN201620088860U 20160128
- International Application: PCT/CN2017/072771 WO 20170126
- International Announcement: WO2017/129140 WO 20170803
- Main IPC: E05F1/08
- IPC: E05F1/08 ; F16C11/10 ; F16C11/04 ; E05F3/20

Abstract:
The invention discloses a folding and unfolding mechanism. The folding and unfolding mechanism is mounted between an upper panel and a lower panel which are hinged, and is used for folding and unfolding the upper panel and the lower panel, and for overturning for 0-180 degrees between the upper panel and the lower panel; wherein the folding and unfolding mechanism comprises a four-connecting-rod assembly, a pushrod assembly and an auxiliary connecting rod assembly; the auxiliary connecting rod assembly comprises a first auxiliary connecting rod and a second auxiliary connecting rod, wherein one end of the first auxiliary connecting rod is hinged to one end of the second auxiliary connecting rod; the other end of the first auxiliary connecting rod is hinged to the lower panel; and the other end of the second auxiliary connecting rod is fixedly connected with a fourth connecting rod. The invention provides a mechanism, mounted between an upper panel and a lower panel which are hinged together, for folding and unfolding the upper panel and the lower panel, and for overturning for 0-180 degrees between the upper panel and the lower panel.
Public/Granted literature
- US20180328401A1 FOLDING AND UNFOLDING MECHANISM Public/Granted day:2018-11-15
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