Invention Grant
- Patent Title: Metal PCB assembly for vehicle lamp and manufacturing method thereof
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Application No.: US15104299Application Date: 2016-01-29
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Publication No.: US10337687B2Publication Date: 2019-07-02
- Inventor: Jaedeok Sung
- Applicant: SEJONG MATERIALS CO., LTD
- Applicant Address: KR Ansan-si, Gyeonggi-Do
- Assignee: SEJONG MATERIALS CO., LTD
- Current Assignee: SEJONG MATERIALS CO., LTD
- Current Assignee Address: KR Ansan-si, Gyeonggi-Do
- Agency: Kile Park Reed & Houtteman PLLC
- Priority: KR10-2015-0038996 20150320
- International Application: PCT/KR2016/000998 WO 20160129
- International Announcement: WO2016/153168 WO 20160929
- Main IPC: H05K1/02
- IPC: H05K1/02 ; F21S43/00 ; F21V19/00 ; H05K3/00 ; H05K3/04 ; H05K1/05 ; F21S43/19 ; F21S43/14 ; F21S43/15 ; F21Y115/10 ; F21Y107/50

Abstract:
The present invention relates to a manufacturing method of a metal PCB assembly for a vehicle lamp and the metal PCB assembly made by the method. The manufacturing method of a metal PCB assembly for a vehicle lamp comprises a step S100 in which a material of a metal PCB 14 is prepared, a step S110 in which a circuit pattern 22 and a plurality of unit patterns 16 are formed and cut from the material of a metal PCB 14 to form a metal PCB 14, a step S120 in which a bending groove 24 is formed on a bottom surface of the metal PCB 14, a step S130 in which each of the unit patterns 16 is protruded forward around the bending groove 24 of the metal PCB 14 such that each of the unit patterns 16 is bent to be inclined from the metal PCB 14, and a step S140 in which a stepwise injection molded products 12 is coupled with the metal PCB 14 while the unit pattern 16 is protruded.
Public/Granted literature
- US20180010775A1 METAL PCB ASSEMBLY FOR VEHICLE LAMP AND MANUFACTURING METHOD THEREOF Public/Granted day:2018-01-11
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