Invention Grant
- Patent Title: Thermal flow meter, temperature measurement device, and thermal flow meter program
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Application No.: US14894938Application Date: 2014-09-08
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Publication No.: US10337900B2Publication Date: 2019-07-02
- Inventor: Takashi Shirai , Hiroyuki Okano
- Applicant: HORIBA STEC, Co., Ltd.
- Applicant Address: JP Kyoto-shi, Kyoto
- Assignee: HORIBA STEC, Co., Ltd.
- Current Assignee: HORIBA STEC, Co., Ltd.
- Current Assignee Address: JP Kyoto-shi, Kyoto
- Agency: Alleman Hall Creasman & Tuttle LLP
- Priority: JP2013-185885 20130909
- International Application: PCT/JP2014/073633 WO 20140908
- International Announcement: WO2015/034081 WO 20150312
- Main IPC: G01F1/696
- IPC: G01F1/696 ; G01F1/698 ; G01F1/69

Abstract:
A thermal flow meter is provided that can accurately correct zero point and span errors, which change depending on an ambient temperature, independently of a fluid type. The thermal flow meter includes: a flow path through which measuring target fluid flows; an upstream side electrical resistive element provided on the upstream side of the flow path; a downstream side electrical resistive element provided on the downstream side of the flow path; and a flow rate calculation part that calculates a flow rate of the measuring target fluid on the basis of an upstream side voltage that is a voltage applied to the upstream side electrical resistive element, a downstream side voltage that is a voltage applied to the downstream side electrical resistive element, and the thermal conductivity of the measuring target fluid.
Public/Granted literature
- US20160131512A1 THERMAL FLOW METER, TEMPERATURE MEASUREMENT DEVICE, AND THERMAL FLOW METER PROGRAM Public/Granted day:2016-05-12
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