Invention Grant
- Patent Title: Apparatus for inspecting back surface of epitaxial wafer and method of inspecting back surface of epitaxial wafer using the same
-
Application No.: US15765349Application Date: 2016-08-03
-
Publication No.: US10338005B2Publication Date: 2019-07-02
- Inventor: Tatsuya Osada , Hideaki Kinbara , Masahiko Egashira
- Applicant: SUMCO CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SUMCO CORPORATION
- Current Assignee: SUMCO CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2015-197776 20151005
- International Application: PCT/JP2016/003583 WO 20160803
- International Announcement: WO2017/061063 WO 20170413
- Main IPC: G01N11/00
- IPC: G01N11/00 ; G01N21/00 ; G01N21/95 ; G01B11/30 ; G01N21/956 ; G01N21/88 ; G01N21/84

Abstract:
Provided is an apparatus for inspecting the back surface of an epitaxial wafer, capable of detecting defects in the back surface of an epitaxial wafer. An epitaxial wafer back surface inspection apparatus has an optical system including an annular fiber optic illuminator and an imaging unit which are placed perpendicular to the back surface of an epitaxial wafer; and a scanning unit operating the optical system in parallel with the back surface to scan the back surface. A light source of the annular fiber optic illuminator is composed of either blue LEDs or red LEDs.
Public/Granted literature
Information query