Invention Grant
- Patent Title: Sensor substrate and sensor device
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Application No.: US15554108Application Date: 2016-07-25
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Publication No.: US10338019B2Publication Date: 2019-07-02
- Inventor: Takashi Kimura , Hidekazu Otomaru
- Applicant: KYOCERA Corporation
- Applicant Address: JP Kyoto
- Assignee: KYOCERA CORPORATION
- Current Assignee: KYOCERA CORPORATION
- Current Assignee Address: JP Kyoto
- Agency: Volpe and Koenig, P.C.
- Priority: JP2015-148711 20150728
- International Application: PCT/JP2016/071741 WO 20160725
- International Announcement: WO2017/018383 WO 20170202
- Main IPC: G01R27/02
- IPC: G01R27/02 ; G01N27/04 ; G01N15/06 ; G01N15/00 ; G01N1/22
Abstract:
A sensor substrate according to the present invention includes an insulating substrate, a detection electrode on a principal surface of the insulating substrate, and resistance wiring including a heating electrode in the insulating substrate. The resistance wiring includes a multilayer wiring portion which is connected to the heating electrode and in which wires and other wires are connected in parallel.
Public/Granted literature
- US20180052128A1 SENSOR SUBSTRATE AND SENSOR DEVICE Public/Granted day:2018-02-22
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