Invention Grant
- Patent Title: System and method for planarizing a substrate
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Application No.: US15094362Application Date: 2016-04-08
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Publication No.: US10338466B2Publication Date: 2019-07-02
- Inventor: Anton J. deVilliers
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: G03F7/00
- IPC: G03F7/00 ; G03F7/32 ; H01L21/027 ; H01L21/3105 ; G03F7/40 ; G03F7/20

Abstract:
Techniques include providing selective or differential planarization such that different regions of a substrate can have different amounts of material removed. In general, methods herein use photo-reactive generator compounds to generate solubility-changing agents. A specific pattern of light is projected onto a substrate containing such photo-reactive generator compounds to create different concentrations of solubility-changing agent(s) at specific locations across a substrate. As generated solubility-changing agents are diffused into an underlying layer, these concentration differences then control an amount (height or depth) of material removed from a given film or layer at specific spatial locations on the substrate.
Public/Granted literature
- US20160300726A1 System and Method for Planarizing a Substrate Public/Granted day:2016-10-13
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