The present invention provides a photosensitive resin laminate in which (A) an alkali-soluble polymer, (B) a compound having an ethylenically unsaturated double bond, and (C) a photosensitive resin layer including a photopolymerization initiator are laminated on a support film. The photosensitive resin laminate is used in forming the protective film of a conductor part, the thickness of the photosensitive resin is 20 μm or less, and the cured product of the photosensitive resin layer satisfies conditions (1) to (3): (1) the crosslink density is 1,000 mol/m3-8,000 mol/m3; (2) the peak top value of Tan δ is 0.4 or greater; and (3) the refractive index at a wavelength of 532 nm is 1.50-1.60.