Invention Grant
- Patent Title: Variable slicing for 3D modeling
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Application No.: US14964916Application Date: 2015-12-10
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Publication No.: US10338566B2Publication Date: 2019-07-02
- Inventor: Zucheul Lee , Daehwan Kim , Yeong-il Seo
- Applicant: KT CORPORATION
- Applicant Address: KR Seongnam-si, Gyeonggi-Do
- Assignee: KT CORPORATION
- Current Assignee: KT CORPORATION
- Current Assignee Address: KR Seongnam-si, Gyeonggi-Do
- Agency: Hamre, Schumann, Muller & Larson, P.C.
- Priority: KR10-2014-0187560 20141223
- Main IPC: B29C67/00
- IPC: B29C67/00 ; G05B19/4099 ; B33Y50/00

Abstract:
Varying a slicing thickness for 3D modeling may include: receiving 3D modeling data from a user device; slicing the 3D modeling data, in accordance with a first thickness, into multiple cross-sections; calculating a complexity of one or more of the multiple cross-sections; and determining a slicing thickness of the 3D modeling data based on the complexity of the one or more of the multiple cross-sections.
Public/Granted literature
- US20160176117A1 VARIABLE SLICING FOR 3D MODELING Public/Granted day:2016-06-23
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