Invention Grant
- Patent Title: Electronic component footprint setup system in collaboration with a circuit layout system and a method thereof
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Application No.: US15671273Application Date: 2017-08-08
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Publication No.: US10338888B2Publication Date: 2019-07-02
- Inventor: Cheng-Ta Lu , Yu-Cheng Hu , Guan-Yu Shih , Kun-You Lin , Mong-Fong Horng
- Applicant: FootPrintKu Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Footprintku Inc.
- Current Assignee: Footprintku Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: G06F17/50
- IPC: G06F17/50 ; G06F7/32 ; G06F16/23

Abstract:
An electronic component footprint setup system in collaboration with a circuit layout system and a method thereof are provided in the present disclosure. The electronic component footprint setup system in collaboration with a circuit layout system provides a user operating the circuit layout system with an interface on which parameters of an electronic component footprint to be created are configured; the parameters of the electronic component footprint are transformed for conforming to electronic component footprint specifications used in the circuit layout system; characteristic values of the electronic component footprint are calculated according to electronic component footprint specifications and electronic component footprint setup regulations; the electronic component footprint is created in the circuit layout system according to the characteristic values.
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Information query