Invention Grant
- Patent Title: Testing module compatibility
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Application No.: US15670377Application Date: 2017-08-07
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Publication No.: US10338987B2Publication Date: 2019-07-02
- Inventor: Vinay Sawal , Marimuthu Sakthivel , Joseph LaSalle White
- Applicant: Dell Products LP
- Applicant Address: US TX Round Rock
- Assignee: Dell Products LP
- Current Assignee: Dell Products LP
- Current Assignee Address: US TX Round Rock
- Agency: Staniford Tomita LLP
- Main IPC: G06F11/07
- IPC: G06F11/07 ; G06F11/36 ; G06F11/22

Abstract:
A module is tested for compatibility with a chassis without being inserted into the chassis. A platform specification and chassis configuration is obtained. Information about the module is received from an NFC tag attached to the module. The information about the module is analyzed against the platform specification and chassis configuration. Based on the analysis, one of a set of conditions is determined to exist. A first condition exists when the module will not be supported according to the platform specification. A second condition exists when the module will be supported and there are no empty slots for which the module will be compatible with the chassis configuration. A third condition exists when the module will be supported and there is at least one empty slot for which the module will be compatible with the chassis configuration. An indication, perceptible to a user, of a determined condition is generated.
Public/Granted literature
- US20190042349A1 TESTING MODULE COMPATIBILITY Public/Granted day:2019-02-07
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