Invention Grant
- Patent Title: Electronic component footprint verification system and a method thereof
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Application No.: US15671347Application Date: 2017-08-08
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Publication No.: US10339263B2Publication Date: 2019-07-02
- Inventor: Yu-Siang Fan Jiang , Mong-Fong Fan Horng , Yan-Jhih Wang , Jun-Qiang Wei , Yi-Ting Chen
- Applicant: FootPrintKu Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Footprintku Inc.
- Current Assignee: Footprintku Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: G06F17/50
- IPC: G06F17/50 ; G06F16/23

Abstract:
An electronic component footprint verification system and a method thereof are provided in the present disclosure. The system is available to an external user for selecting an electronic component footprint to be verified, reading a verification rule checklist in an external database, extracting characteristics of the electronic component footprint, accessing characteristic data from the electronic component footprint, verifying the characteristic data based on the verification rule checklist, and displaying a verification result.
Public/Granted literature
- US20190050518A1 ELECTRONIC COMPONENT FOOTPRINT VERIFICATION SYSTEM AND A METHOD THEREOF Public/Granted day:2019-02-14
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