Invention Grant
- Patent Title: Bonding junction structure
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Application No.: US15761113Application Date: 2016-09-29
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Publication No.: US10340154B2Publication Date: 2019-07-02
- Inventor: Yoichi Kamikoriyama , Shinichi Yamauchi
- Applicant: Mitsui Mining & Smelting Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: MITSUI MINING & SMELTING CO., LTD.
- Current Assignee: MITSUI MINING & SMELTING CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Young & Thompson
- Priority: JP2015-196957 20151002
- International Application: PCT/JP2016/078946 WO 20160929
- International Announcement: WO2017/057645 WO 20170406
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L21/52 ; H01L21/02 ; H01L21/47 ; B22F7/08 ; H01L21/477 ; H01L23/00

Abstract:
Provided is a bonding joining structure in which a heat generating body and a support including a metal are joined to each other via a joint portion composed of a sintered body of copper powder. The support contains copper or gold, the copper or gold being present in at least an outermost surface of the support. An interdiffusion portion in which copper or gold contained in the support and copper contained in the sintered body is formed so as to straddle a bonding interface between the support and the sintered body. Preferably, a copper crystal structure having the same crystal orientation is formed in the interdiffusion portion so as to straddle the bonding interface.
Public/Granted literature
- US20180269074A1 BONDING JUNCTION STRUCTURE Public/Granted day:2018-09-20
Information query
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