- Patent Title: Semiconductor apparatus and semiconductor system including the same
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Application No.: US16036413Application Date: 2018-07-16
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Publication No.: US10340255B2Publication Date: 2019-07-02
- Inventor: Kwan Dong Kim
- Applicant: SK hynix Inc.
- Applicant Address: KR Icheon-si, Gyeonggi-do
- Assignee: SK hynix Inc.
- Current Assignee: SK hynix Inc.
- Current Assignee Address: KR Icheon-si, Gyeonggi-do
- Agency: William Park & Associates Ltd.
- Priority: KR10-2016-0113798 20160905
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L25/065 ; H01L23/00 ; H01L27/11 ; H01L27/112 ; H01L27/108 ; H01L23/522
Abstract:
A semiconductor apparatus may include a package substrate, and a plurality of semiconductor chips. Wherein the package substrate and the semiconductor chips may be configured based on a load value of the semiconductor apparatus.
Public/Granted literature
- US20180323176A1 SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR SYSTEM INCLUDING THE SAME Public/Granted day:2018-11-08
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