Invention Grant
- Patent Title: Integrated circuit for reducing ohmic drop in power rails
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Application No.: US15718275Application Date: 2017-09-28
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Publication No.: US10340263B2Publication Date: 2019-07-02
- Inventor: Hyo Sig Won , Chan Uk Shin , Kwang Ok Jeong , Kwon Chil Kang
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-Do
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2016-0170757 20161214
- Main IPC: H01L27/02
- IPC: H01L27/02 ; H01L29/06 ; H01L23/522 ; G06F17/50 ; H01L23/528 ; H03K19/00 ; H03K5/00 ; H03K3/03 ; H03K5/134 ; H01L27/118

Abstract:
An integrated circuit includes a plurality of power rail pairs and a circuit chain. Each of the plurality of power rail pairs includes one of a plurality of high power rails configured to provide a first power supply voltage and one of a plurality of low power rails configured to provide a second power supply voltage that is lower than the first power supply voltage. The circuit chain includes a plurality of unit circuits that are cascade-connected such that an output of a previous unit circuit is provided as an input of a next unit circuit. The plurality of unit circuits are connected distributively to the plurality of power rail pairs.
Public/Granted literature
- US20180166432A1 INTEGRATED CIRCUIT FOR REDUCING OHMIC DROP IN POWER RAILS Public/Granted day:2018-06-14
Information query
IPC分类: