Invention Grant
- Patent Title: CMOS image sensor
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Application No.: US16019281Application Date: 2018-06-26
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Publication No.: US10340304B2Publication Date: 2019-07-02
- Inventor: Dae-Sub Jung , Deyan Chen , Xuejie Shi
- Applicant: Semiconductor Manufacturing International (Shanghai) Corporation , Semiconductor Manufacturing International (Beijing) Corporation
- Applicant Address: CN Shanghai CN Beijing
- Assignee: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION,SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION
- Current Assignee: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION,SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION
- Current Assignee Address: CN Shanghai CN Beijing
- Agency: Anova Law Group, PLLC
- Priority: CN201610008022 20160107
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L27/146

Abstract:
The present disclosure provides CMOS image sensors. A CMOS image sensor includes a substrate having a first region and a second region connecting with the first region at a first end of the first region; a transfer transistor formed on the surface of the substrate in the second region; a floating diffusion (FD) region formed in the surface of the substrate at one side of the transfer transistor in the second region; a third implanting region formed in the surface of the substrate 200 in the first region, being formed from a first implanting region; a second implanting region and an adjacent fifth implanting region formed under the third implanting region; and a fourth implanting region formed under the second implanting region and the fifth implanting region, being electrically connected with the third implanting region by the fifth implanting region.
Public/Granted literature
- US20180308893A1 CMOS IMAGE SENSOR Public/Granted day:2018-10-25
Information query
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