Invention Grant
- Patent Title: Gate structure with dual width electrode layer
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Application No.: US15889321Application Date: 2018-02-06
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Publication No.: US10340359B2Publication Date: 2019-07-02
- Inventor: Elliot John Smith
- Applicant: GLOBALFOUNDRIES Inc.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee Address: KY Grand Cayman
- Agency: Amerson Law Firm, PLLC
- Main IPC: H01L29/51
- IPC: H01L29/51 ; H01L21/308 ; H01L21/306 ; H01L29/786 ; H01L29/417 ; H01L29/66 ; H01L29/06 ; H01L21/84 ; H01L27/12 ; H01L21/3213

Abstract:
A high-k dielectric metal gate (HKMG) transistor includes a substrate, an HKMG gate stack with a gate dielectric layer and a gate electrode layer positioned above the substrate. The gate electrode layer has an upper portion and a lower portion. A first liner contacts a sidewall portion of the upper portion. A spacer contacts the first liner and a sidewall portion of the lower portion. Raised source and drain regions are positioned adjacent the spacer. A height of the uppermost surface of the spacer is greater than a height of an uppermost surface of the raised source and drain regions. A width of the upper portion between the raised source and drain regions is smaller than a width of the lower portion between the raised source and drain regions.
Public/Granted literature
- US20180175155A1 GATE STRUCTURE WITH DUAL WIDTH ELECTRODE LAYER Public/Granted day:2018-06-21
Information query
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