Invention Grant
- Patent Title: Epitaxial substrate for field effect transistor
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Application No.: US12527142Application Date: 2008-02-12
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Publication No.: US10340375B2Publication Date: 2019-07-02
- Inventor: Masahiko Hata , Hiroyuki Sazawa , Naohiro Nishikawa
- Applicant: Masahiko Hata , Hiroyuki Sazawa , Naohiro Nishikawa
- Applicant Address: JP Tokyo
- Assignee: SUMITOMO CHEMICAL COMPANY, LIMITED
- Current Assignee: SUMITOMO CHEMICAL COMPANY, LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Fitch, Even, Tabin & Flannery, LLP
- Priority: JP2007-036626 20070216
- International Application: PCT/JP2008/052602 WO 20080212
- International Announcement: WO2008/099949 WO 20080821
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L31/00 ; H01L29/778 ; H01L29/207 ; H01L29/66 ; H01L21/02 ; H01L29/20

Abstract:
The present invention provides an epitaxial substrate for field effect transistor. In the epitaxial substrate for field effect transistor, a nitride-based Group III-V semiconductor epitaxial crystal containing Ga is interposed between the ground layer and the operating layer, and the nitride-based Group III-V semiconductor epitaxial crystal includes the following (i), (ii) and (iii). (i) a first buffer layer containing Ga or Al and containing a high resistivity crystal layer having added thereto compensation impurity element present in the same period as Ga in the periodic table and having small atomic number; (ii) a second buffer layer containing Ga or Al, laminated on the operating layer side of the first buffer layer; and (iii) a high purity epitaxial crystal layer containing acceptor impurities in a slight amount such that non-addition or depletion state can be maintained, provided between the high resistivity layer and the operating layer.
Public/Granted literature
- US20100019277A1 EPITAXIAL SUBSTRATE FOR FIELD EFFECT TRANSISTOR Public/Granted day:2010-01-28
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