According to one embodiment, a semiconductor device includes a first electrode, a first semiconductor region of a first conductivity type, a second semiconductor region of a second conductivity type, a third semiconductor region of the first conductivity type, a gate electrode, a fourth semiconductor region of the second conductivity type, an interconnect portion, and a second electrode. The gate electrode includes a first portion, a second portion, and a third portion between the first portion and the second portion. The first portion opposes the first to third semiconductor regions. The second portion is separated from the first portion. The fourth semiconductor region includes a first region opposing the second portion. The interconnect portion is electrically connected to the third portion. The second electrode is provided on the second and third semiconductor regions and the first region. The second electrode is electrically connected to the second to fourth semiconductor regions.