Invention Grant
- Patent Title: Perpendicular magnetic memory with filament conduction path
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Application No.: US15735613Application Date: 2015-06-26
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Publication No.: US10340443B2Publication Date: 2019-07-02
- Inventor: Brian S. Doyle , Kaan Oguz , Kevin P. O'Brien , David L. Kencke , Elijah V. Karpov , Charles C. Kuo , Mark L. Doczy , Satyarth Suri , Robert S. Chau , Niloy Mukherjee , Prashant Majhi
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Trop, Pruner & Hu, P.C.
- International Application: PCT/US2015/037898 WO 20150626
- International Announcement: WO2016/209249 WO 20161229
- Main IPC: H01L43/02
- IPC: H01L43/02 ; H01L43/08 ; H01L45/00 ; H01L27/22 ; H01L43/10

Abstract:
An embodiment includes an apparatus comprising: first and second electrodes on a substrate; a perpendicular magnetic tunnel junction (pMTJ), between the first and second electrodes, comprising a dielectric layer between a fixed layer and a free layer; and an additional dielectric layer directly contacting first and second metal layers; wherein (a) the first metal layer includes an active metal and the second metal includes an inert metal, and (b) the second metal layer directly contacts the free layer. Other embodiments are described herein.
Public/Granted literature
- US20180323367A1 PERPENDICULAR MAGNETIC MEMORY WITH FILAMENT CONDUCTION PATH Public/Granted day:2018-11-08
Information query
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