Invention Grant
- Patent Title: Bonded substrate, surface acoustic wave element, surface acoustic wave device, and method of manufacturing bonded substrate
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Application No.: US15423979Application Date: 2017-02-03
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Publication No.: US10340881B2Publication Date: 2019-07-02
- Inventor: Kouhei Kurimoto , Kazuhito Kishida , Rinzo Kayano , Jun Mizuno , Shoji Kakio
- Applicant: Kouhei Kurimoto , Kazuhito Kishida , Rinzo Kayano , WASEDA UNIVERSITY , Shoji Kakio
- Applicant Address: JP Tokyo JP Tokyo JP Yamanashi
- Assignee: THE JAPAN STEEL WORKS, LTD.,WASEDA UNIVERSITY,UNIVERSITY OF YAMANASHI
- Current Assignee: THE JAPAN STEEL WORKS, LTD.,WASEDA UNIVERSITY,UNIVERSITY OF YAMANASHI
- Current Assignee Address: JP Tokyo JP Tokyo JP Yamanashi
- Agency: Holtz, Holtz & Volek PC
- Priority: JP2016-157122 20160810
- Main IPC: H03H9/25
- IPC: H03H9/25 ; H03H9/02 ; H03H3/08 ; H03H9/64

Abstract:
There is provided a bonded substrate including: a quartz substrate; and a piezoelectric substrate which is bonded on the quartz substrate and on which a surface acoustic wave propagates, wherein the quartz substrate and the piezoelectric substrate are bonded at a bonding interface through covalent bonding, and a surface acoustic wave element having a higher phase velocity and a higher electromechanical coupling factor than conventional one is obtained by disposing an interdigital electrode on a principal surface of the piezoelectric substrate.
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