Invention Grant
- Patent Title: Electronic device including a reinforced printed circuit board
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Application No.: US15351087Application Date: 2016-11-14
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Publication No.: US10342127B2Publication Date: 2019-07-02
- Inventor: Jung Hoon Park , Jin Woo Kim , Dae Kwang Kim
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd
- Current Assignee: Samsung Electronics Co., Ltd
- Current Assignee Address: KR
- Agency: The Farrell Law Firm, P.C.
- Main IPC: H05K1/09
- IPC: H05K1/09 ; H05K1/11 ; H05K5/02 ; H05K7/14 ; H05K1/02

Abstract:
An electronic device including reinforced printed circuit board is provided. The electronic device includes the printed circuit board including a first area, and a second area that extends from a first end of the first area. A width of the second area is smaller than a width of the first area, and at least a portion of a surface of the second area is covered by a material layer that provides the second area with a specific strength.
Public/Granted literature
- US20180139862A1 ELECTRONIC DEVICE INCLUDING A REINFORCED PRINTED CIRCUIT BOARD Public/Granted day:2018-05-17
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