Invention Grant
- Patent Title: Plasma emitting method and plasma emitting device
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Application No.: US15314047Application Date: 2014-05-30
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Publication No.: US10343132B2Publication Date: 2019-07-09
- Inventor: Akihiro Niwa , Takahiro Jindo , Toshiyuki Ikedo
- Applicant: FUJI CORPORATION
- Applicant Address: JP Chiryu
- Assignee: FUJI CORPORATION
- Current Assignee: FUJI CORPORATION
- Current Assignee Address: JP Chiryu
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- International Application: PCT/JP2014/064404 WO 20140530
- International Announcement: WO2015/181945 WO 20151203
- Main IPC: B01J19/08
- IPC: B01J19/08 ; C01B13/11 ; C02F1/46 ; H05H1/24

Abstract:
Water is flowed inside main body section formed from an insulating material such that a specified space remains inside the main body section. Electrodes and are arranged along the outer walls of the main body section and voltage is applied to the electrodes. Processing gas present inside the main body section is plasmarized and plasma is emitted to the water flowing inside the main body section.
Public/Granted literature
- US20170182473A1 PLASMA EMITTING METHOD AND PLASMA EMITTING DEVICE Public/Granted day:2017-06-29
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