Invention Grant
- Patent Title: Polishing composition and polishing method using the same
-
Application No.: US14561188Application Date: 2014-12-04
-
Publication No.: US10344187B2Publication Date: 2019-07-09
- Inventor: Masashi Teramoto , Shinichi Ogata , Ryuichi Tanimoto
- Applicant: NITTA HAAS INCORPORATED , SUMCO CORPORATION
- Applicant Address: JP Osaka JP Tokyo
- Assignee: NITTA HAAS INCORPORATED,SUMCO CORPORATION
- Current Assignee: NITTA HAAS INCORPORATED,SUMCO CORPORATION
- Current Assignee Address: JP Osaka JP Tokyo
- Agency: Hauptman Ham, LLP
- Priority: JP2011-022110 20110203
- Main IPC: C09G1/04
- IPC: C09G1/04 ; H01L21/02 ; C09G1/02 ; H01L21/306
Abstract:
Provided is a polishing composition that does not contain abrasives and that is used for polishing a silicon wafer, the polishing composition including a pH buffer, a polishing accelerator, a water-soluble polymer, and a block-type compound. By polishing a silicon wafer by using the polishing composition, a polishing speed of greater than 0.1 μm/min can be achieved.
Public/Granted literature
- US20150083962A1 POLISHING COMPOSITION AND POLISHING METHOD USING THE SAME Public/Granted day:2015-03-26
Information query
