A communication-type thermal conduction device includes a vapor chamber, at least one heat pipe, and at least one third capillary structure. The vapor chamber has a bottom board. A first capillary structure is disposed on an inner surface of the bottom board. A second capillary structure is disposed in the heat pipe. One end portion of the heat pipe is connected to the bottom board, and the end portion has an open portion in communication with the heat pipe and the vapor chamber. The second capillary structure has a connected portion exposed by means of the open portion. The third capillary structure is connected to the first capillary structure and the connected portion, so that the first and second capillary structures are in communication with each other. Accordingly, holistic thermal conduction can be achieved, and the vapor chamber incorporating the heat pipe can provide the desired heat dissipation effect.