A heat-dissipating cooling pad includes a top layer of stone material, a bottom layer of stone material, an inner layer of copper material embedded within an inner cavity defined in an annular-shaped middle portion of the bottom layer of stone material, and an annular-shaped outer layer of aluminum material embedded within an annular-shaped outer cavity defined in an annular-shaped outer portion of the bottom layer of stone material surrounding and spaced outwardly from the annular-shaped middle portion of the bottom layer of stone material. The top layer of stone material and the bottom layer of stone material are adhered to one another.