A method for evaluating warpage of a wafer, includes measuring the warpage of the wafer that is in a free state without suction and determining, from measured warpage data, a wafer warpage amount A between two points Q1 and Q2 and a wafer warpage amount B between two points R1 and R2, the points Q1 and Q2 being located on a straight line passing through an arbitrary point P in a wafer plane and a distance “a” away from the point P, the points R1 and R2 being located on the same straight line and a distance “b” away from the point P, the distance “b” differing from the distance “a”, calculating, from the wafer warpage amount A and the wafer warpage amount B, a difference in wafer warpage amount at the point P, and evaluating the warpage on the basis of the difference in wafer warpage amount.