Invention Grant
- Patent Title: Stripping process
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Application No.: US15813431Application Date: 2017-11-15
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Publication No.: US10345707B2Publication Date: 2019-07-09
- Inventor: Raj Sakamuri , Sanjay Malik , Ognian Dimov
- Applicant: Fujifilm Electronic Materials U.S.A., Inc.
- Applicant Address: US RI N. Kingstown
- Assignee: Fujifilm Electronic Materials U.S.A., Inc.
- Current Assignee: Fujifilm Electronic Materials U.S.A., Inc.
- Current Assignee Address: US RI N. Kingstown
- Agency: Fish & Richardson P.C.
- Main IPC: G03F7/42
- IPC: G03F7/42 ; C08G73/10 ; G03F7/16 ; G03F7/20 ; G03F7/32 ; G03F7/40 ; H01L21/306 ; H01L21/3065 ; G03F7/037 ; G03F7/11 ; H01L21/311
Abstract:
This disclosure relates to a process for stripping an organic film on a patterned semiconductor substrate. The process includes treating the organic film with an aqueous stripper composition to remove the organic film in one step. The organic film includes at least a first layer and a second layer, the first layer has a dissolution rate of at most about 0.01μ/min in a developer at 25° C., and the second layer has a dissolution rate of greater than about 0.01μ/min in the developer at 25° C.
Public/Granted literature
- US20180136563A1 Stripping Process Public/Granted day:2018-05-17
Information query
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