Invention Grant
- Patent Title: Mask cooling apparatus and mask cooling method
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Application No.: US15820045Application Date: 2017-11-21
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Publication No.: US10345719B2Publication Date: 2019-07-09
- Inventor: Xuan Liu
- Applicant: Semiconductor Manufacturing International (Shanghai) Corporation , Semiconductor Manufacturing International (Beijing) Corporation
- Applicant Address: CN Shanghai CN Beijing
- Assignee: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION,SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION
- Current Assignee: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION,SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION
- Current Assignee Address: CN Shanghai CN Beijing
- Agency: Anova Law Group, PLLC
- Priority: CN201611073836 20161129
- Main IPC: G03B27/52
- IPC: G03B27/52 ; G03B27/42 ; G03B27/58 ; G03B27/62 ; G03F7/20

Abstract:
Mask cooling apparatus and mask cooling methods are provided. An exemplary mask cooling apparatus includes a cooler, having a cooling region, a coolant inlet region and a coolant outlet region; cooling channels, disposed in the cooling region of the cooler and used to contact with the mask; coolant inlet channels, disposed in the coolant inlet region and used to introduce a coolant in the cooling channels; and coolant outlet channels, disposed in the coolant outlet region and used to drain the coolant out from the cooling channels.
Public/Granted literature
- US20180149985A1 MASK COOLING APPARATUS AND MASK COOLING METHOD Public/Granted day:2018-05-31
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