• Patent Title: Assembling buckle structure for memory circuit board
  • Application No.: US16147589
    Application Date: 2018-09-29
  • Publication No.: US10346735B1
    Publication Date: 2019-07-09
  • Inventor: Wen-Yi Lee
  • Applicant: Wen-Yi Lee
  • Applicant Address: TW New Taipei
  • Assignee: Wen-Yi Lee
  • Current Assignee: Wen-Yi Lee
  • Current Assignee Address: TW New Taipei
  • Main IPC: H05K5/02
  • IPC: H05K5/02 H05K5/03 G06K19/077
Assembling buckle structure for memory circuit board
Abstract:
An assembling buckle structure for memory circuit board includes: a base, two sides thereof are respectively formed with an elastic lateral plate having at least a buckle part, two ends of the lateral plate is formed with at least an outer mounting convex and a fasten post, the rear end of the base is formed with a tail plate having at least a buckle part; a memory circuit board disposed in the base, the front end thereof is formed with a connection seat; and a cover, covered and engaged with the base, the front end thereof is formed with a penetrated hole, two inner ends thereof are formed with at least an inner mounting concave; accordingly, the memory circuit board, the base and the cover are able to be stably buckled and combined in any direction without using any screw.
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