Invention Grant
- Patent Title: Assembling buckle structure for memory circuit board
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Application No.: US16147589Application Date: 2018-09-29
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Publication No.: US10346735B1Publication Date: 2019-07-09
- Inventor: Wen-Yi Lee
- Applicant: Wen-Yi Lee
- Applicant Address: TW New Taipei
- Assignee: Wen-Yi Lee
- Current Assignee: Wen-Yi Lee
- Current Assignee Address: TW New Taipei
- Main IPC: H05K5/02
- IPC: H05K5/02 ; H05K5/03 ; G06K19/077

Abstract:
An assembling buckle structure for memory circuit board includes: a base, two sides thereof are respectively formed with an elastic lateral plate having at least a buckle part, two ends of the lateral plate is formed with at least an outer mounting convex and a fasten post, the rear end of the base is formed with a tail plate having at least a buckle part; a memory circuit board disposed in the base, the front end thereof is formed with a connection seat; and a cover, covered and engaged with the base, the front end thereof is formed with a penetrated hole, two inner ends thereof are formed with at least an inner mounting concave; accordingly, the memory circuit board, the base and the cover are able to be stably buckled and combined in any direction without using any screw.
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