Invention Grant
- Patent Title: Resistor element and resistor element assembly
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Application No.: US15652927Application Date: 2017-07-18
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Publication No.: US10347404B2Publication Date: 2019-07-09
- Inventor: Kwang Hyun Park , Jang Seok Yun , Kyung Seon Baek
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-Do
- Agency: Morgan Lewis & Bockius LLP
- Priority: KR10-2016-0143439 20161031
- Main IPC: H01C7/18
- IPC: H01C7/18 ; H01C1/148 ; H01C1/01 ; H05K1/18 ; H01C17/065 ; H01C17/24 ; H05K3/34

Abstract:
A resistor element includes a base substrate having first and second surfaces opposing each other and first and second end surfaces opposing each other and connecting the first and second surfaces. A first resistor layer is on the first surface of the base substrate. First and second terminals are respectively on the first and second end surfaces. A second resistor layer is on the first resistor layer, is connected to the first and second terminals, and includes a copper-manganese-tin (Cu—Mn—Sn)-based composition.
Public/Granted literature
- US20180122539A1 RESISTOR ELEMENT AND RESISTOR ELEMENT ASSEMBLY Public/Granted day:2018-05-03
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