Invention Grant
- Patent Title: Stress management scheme for fabricating thick magnetic films of an inductor yoke arrangement
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Application No.: US15599754Application Date: 2017-05-19
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Publication No.: US10347411B2Publication Date: 2019-07-09
- Inventor: Hariklia Deligianni , Bruce B. Doris , Eugene J. O'Sullivan , Naigang Wang
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent Vazken Alexanian
- Main IPC: H01F7/06
- IPC: H01F7/06 ; H01F27/245 ; H01F41/02

Abstract:
Embodiments of the invention are directed to a method of fabricating a yoke arrangement of an inductor. A non-limiting example method includes forming a dielectric layer across from a major surface of a substrate. The method further includes configuring the dielectric layer such that it imparts a predetermined dielectric layer compressive stress on the substrate. A magnetic stack is formed on an opposite side of the dielectric layer from the substrate, wherein the magnetic stack includes one or more magnetic layers alternating with one or more insulating layers. The method further includes configuring the magnetic stack such that it imparts a predetermined magnetic stack tensile stress on the dielectric layer, wherein a net effect of the predetermined dielectric layer compressive stress and the predetermined magnetic stack tensile stress on the substrate is insufficient to cause a portion of the major surface of the substrate to be substantially non-planar.
Public/Granted literature
- US20180336991A1 STRESS MANAGEMENT FOR THICK MAGNETIC FILM INDUCTORS Public/Granted day:2018-11-22
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