Invention Grant
- Patent Title: Multilayer ceramic electronic component and method of manufacturing the same
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Application No.: US15790963Application Date: 2017-10-23
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Publication No.: US10347421B2Publication Date: 2019-07-09
- Inventor: Hae Suk Chung , Byoung Hwa Lee , Min Cheol Park , Eun Hyuk Chae
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2012-0016309 20120217
- Main IPC: H01G4/012
- IPC: H01G4/012 ; H01G4/30 ; H01F17/00 ; H01C7/10 ; H01G4/005 ; H01G4/12 ; H01F27/29

Abstract:
There is provided a multilayer ceramic electronic component, including: a ceramic body having external electrodes; and internal electrodes disposed between ceramic layers within the ceramic body, the ceramic body having a width smaller than a length thereof and the number of laminated internal electrodes being 250 or more, wherein when the thickness of the ceramic layer is denoted by Td and the thickness of the internal electrode is denoted by Te, 0.5≤Te/Td≤2.0, and when the thickness of a central portion of the ceramic body is denoted by Tm and the thickness of each of side portions of the ceramic body is denoted by Ta, 0.9≤Ta/Tm≤0.97, and thus, a multilayer ceramic electronic component having low equivalent series inductance (ESL) may be obtained.
Public/Granted literature
- US20180061571A1 MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2018-03-01
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