Invention Grant
- Patent Title: Chip-shaped electronic component
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Application No.: US15480511Application Date: 2017-04-06
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Publication No.: US10347426B2Publication Date: 2019-07-09
- Inventor: Kazunori Egashira , Kazunori Kunimoto , Seiji Katsuta , Yosuke Terashita , Takayoshi Yamamoto
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2016-172853 20160905
- Main IPC: H01G4/248
- IPC: H01G4/248 ; H01B1/02 ; H01G4/30 ; H01G4/12 ; H01G4/232

Abstract:
An external electrode includes an underlying electrode layer on an end surface of a ceramic body and connected to an internal electrode, an external electrode layer located outside the underlying electrode layer, and an intermediate electrode layer including at least a portion between the underlying electrode layer and the external electrode layer. The intermediate electrode layer includes a conductive resin, and the underlying electrode layer and the external electrode layer include a material lower in electrical resistivity than the conductive resin. The intermediate electrode layer entirely or substantially entirely covers the end surfaces and extends from the end surfaces to portions, respectively, of one main surface, and the underlying electrode layer is partially exposed from the intermediate electrode layer to include an exposed surface and is in surface-contact with the external electrode layer at the exposed surface.
Public/Granted literature
- US20180068792A1 CHIP-SHAPED ELECTRONIC COMPONENT Public/Granted day:2018-03-08
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