Invention Grant
- Patent Title: Printed circuit board assembly
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Application No.: US15794121Application Date: 2017-10-26
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Publication No.: US10347451B2Publication Date: 2019-07-09
- Inventor: Moon Jung Park , Gon Jae Lee
- Applicant: MANDO Corporation
- Applicant Address: KR Pyeongtaek-si, Gyeonggi-do
- Assignee: MANDO CORPORATION
- Current Assignee: MANDO CORPORATION
- Current Assignee Address: KR Pyeongtaek-si, Gyeonggi-do
- Agency: Hauptman Ham, LLP
- Priority: KR10-2016-0140195 20161026
- Main IPC: H01H37/76
- IPC: H01H37/76 ; H01H85/055 ; H01H85/20 ; H01H85/36 ; H05K1/02 ; H01H37/04 ; H01H85/02

Abstract:
A printed circuit board (PCB) assembly according to one embodiment of the present disclosure includes a first pad; a second pad disposed to be spaced apart from the first pad; and a thermal fuse provided with a first terminal and a second terminal which are each coupled to the first pad and the second pad by soldering. Here, a contact area between the first pad and the first terminal is smaller than that between the second pad and the second terminal.
Public/Granted literature
- US20180114657A1 PRINTED CIRCUIT BOARD ASSEMBLY Public/Granted day:2018-04-26
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