Invention Grant
- Patent Title: Process chamber and semiconductor processing apparatus
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Application No.: US15109050Application Date: 2014-12-29
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Publication No.: US10347470B2Publication Date: 2019-07-09
- Inventor: Feng Lv , Fenggang Zhang , Mengxin Zhao , Peijun Ding
- Applicant: BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.
- Applicant Address: CN
- Assignee: BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.
- Current Assignee: BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.
- Current Assignee Address: CN
- Agency: Bracewell LLP
- Agent Brad Y. Chin
- Priority: CN201310737531 20131229; CN201410431336 20140828
- International Application: PCT/CN2014/095338 WO 20141229
- International Announcement: WO2015/096819 WO 20150702
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H01L21/67 ; C23C14/00 ; C23C14/34 ; C23C14/56 ; H01J37/34

Abstract:
Embodiments of the invention provide a process chamber and a semiconductor processing apparatus. According to at least one embodiment, the process chamber includes a reaction compartment, a gas introducing system and a wafer transfer device. The reaction compartment is provided in the process chamber and used for performing a process on a wafer, the gas introducing system is used for providing processing gas to the reaction compartment, and the wafer transfer device is used for transferring the wafer into the reaction compartment. A lining ring assembly is provided in the reaction compartment, and is configured such that a flow uniformizing cavity is formed between the lining ring assembly itself and an inner side wall of the reaction compartment, so as to uniformly transport the processing gas, from the gas introducing system, into the reaction compartment through the flow uniformizing cavity.
Public/Granted literature
- US20160322206A1 PROCESS CHAMBER AND SEMICONDUCTOR PROCESSING APPARATUS Public/Granted day:2016-11-03
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