Invention Grant
- Patent Title: Substrate processing apparatus, substrate processing method, and storage medium with program stored therein for executing substrate processing method
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Application No.: US15661157Application Date: 2017-07-27
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Publication No.: US10347482B2Publication Date: 2019-07-09
- Inventor: Takayuki Toshima , Shoichi Terada , Junji Nakamura
- Applicant: Tokyo Electron Limited
- Applicant Address: SA Dhahran
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: SA Dhahran
- Agency: Abelman, Frayne & Schwab
- Priority: JP2016-154860 20160805
- Main IPC: B08B3/10
- IPC: B08B3/10 ; H01L21/02 ; B08B3/08 ; H01L21/67 ; H01L21/311 ; H01L21/3213
Abstract:
The present disclosure relates to a processing liquid supplying unit configured to supply a processing liquid that contains a removing agent of an adhered substance and a solvent having a boiling point lower than a boiling point of the removing agent to a substrate, a substrate heating unit configured to subsequently heat the substrate at a predetermined temperature that is equal to or higher than the boiling point of the solvent in the processing liquid and is lower than the boiling point of the removing agent, and a rinsing liquid supplying unit configured to subsequently supply a rinsing liquid to the substrate so as to remove the adhered substance from the substrate.
Public/Granted literature
Information query
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