Invention Grant
- Patent Title: Method to remove residual charge on a electrostatic chuck during the de-chucking step
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Application No.: US15458666Application Date: 2017-03-14
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Publication No.: US10347522B2Publication Date: 2019-07-09
- Inventor: Wendell Glen Boyd, Jr. , Tom K. Cho , Robert T. Hirahara
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/687 ; H01J37/32
Abstract:
A method and apparatus for discharging a residual charge from a substrate support. In one example, a substrate support is provided that includes a body, an electrode disposed in the body, a radiation emitter and a diffuser. The body has one or more holes formed in a workpiece support surface, the workpiece support surface configured to accept a substrate thereon. The electrode is configured to electrostatically hold a substrate to the workpiece support surface. The radiation emitter is disposed in a first hole of the one or more holes formed in the workpiece support surface. The radiation emitter is configured to emit electromagnetic energy out of the first hole. The diffuser is disposed in first hole over the radiation emitter.
Public/Granted literature
- US20170263487A1 METHOD TO REMOVE RESIDUAL CHARGE ON A ELECTROSTATIC CHUCK DURING THE DE-CHUCKING STEP Public/Granted day:2017-09-14
Information query
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